News
2023-10-25
Fan-out Packaging Glass Carrier Boards - Contrel Creates a Complete Solution for Cutting and Repairing
Contrel Technology (8064) participated in this year's TPCA exhibition with the theme of "Fan-out Packaged Glass Carrier Dicing and Repairing Solution", responding to the demand for equipment for high-end chip applications such as 5G communication, AI artificial intelligence, and Internet of Things (IoT), and demonstrating the development results of the carrier edge trimming, rewire repair, and TGV drilling in the various stages of the production process equipment.
Contrel Technology provides a full range of solutions, including RDL laser circuit repair, glass carrier dicing, glass substrate drilling for packaging, glass carrier edge EMC trimming, laser stripping equipment, and plasma etching, all of which are available.
The RDL (Redistributed Line) laser circuit repair equipment is equipped with the function of repairing metal line defects, and can control the repair line width to 1μm, so as to meet the repair of products with 2μm circuit width spacing. It is also equipped with automatic optical measurement, with low to high magnification lens flexibility, to realize fast automated and accurate measurement, and can automatically plan the repair path, effectively saving cost and efficiency.
The glass cutting machine is equipped with a dual-laser dual-axis structure for texturizing and thermal cracking, which allows for fast and automated cutting of transparent, hard and brittle materials with composite structures and shaped shapes, and the chipping angle of the cutter is controlled to be within 10 μm, in order to meet the demands of high-yield and high-quality manufacturing processes. In terms of glass substrate drilling equipment, Contrel Technology utilizes laser texturizing and wet processing to complete TGV technology with a depth-to-width ratio of more than 5 to 1. The glass carrier edge-mounted epoxy resin (EMC) trimming equipment employs simultaneous laser double-sided operation to precisely remove the overflow of adhesive on the edges, so that glass carriers can be reused after the disassembly process, which is in line with the concept of green and environmentally friendly production. The laser stripping and plasma etching equipment utilizes the integrated design of plasma microwave and radiofrequency, which has stronger adhesive residue removal capability and realizes the dual-process automation integration structure.
Contrel Technology is also deeply engaged in the Micro-LED (Micro Light Emitting Diode) display field, and has proposed the laser-induced transfer bonding technology, which can be applied to the two mainstream backplanes COB and COG. This Micro LED mass transfer equipment can complete the mass release and fusion bonding at the same time, and together with the intelligent selective mass patching system, it can increase the final yield rate of the product up to 99.999%.
Contrel Technology fully demonstrates its advantages in core technologies such as laser, optical inspection, and automated mechanical and electrical integration at the exhibition, and jointly exhibits with Tongtai Machine & Tool. Visitors are welcome to witness the latest technologies and innovations in the fields of semiconductor packaging and Micro-LEDs. Booth No.: N-1321.
Reported by Xu Yuqing, Economic Daily News
Contrel Technology provides a full range of solutions, including RDL laser circuit repair, glass carrier dicing, glass substrate drilling for packaging, glass carrier edge EMC trimming, laser stripping equipment, and plasma etching, all of which are available.
The RDL (Redistributed Line) laser circuit repair equipment is equipped with the function of repairing metal line defects, and can control the repair line width to 1μm, so as to meet the repair of products with 2μm circuit width spacing. It is also equipped with automatic optical measurement, with low to high magnification lens flexibility, to realize fast automated and accurate measurement, and can automatically plan the repair path, effectively saving cost and efficiency.
The glass cutting machine is equipped with a dual-laser dual-axis structure for texturizing and thermal cracking, which allows for fast and automated cutting of transparent, hard and brittle materials with composite structures and shaped shapes, and the chipping angle of the cutter is controlled to be within 10 μm, in order to meet the demands of high-yield and high-quality manufacturing processes. In terms of glass substrate drilling equipment, Contrel Technology utilizes laser texturizing and wet processing to complete TGV technology with a depth-to-width ratio of more than 5 to 1. The glass carrier edge-mounted epoxy resin (EMC) trimming equipment employs simultaneous laser double-sided operation to precisely remove the overflow of adhesive on the edges, so that glass carriers can be reused after the disassembly process, which is in line with the concept of green and environmentally friendly production. The laser stripping and plasma etching equipment utilizes the integrated design of plasma microwave and radiofrequency, which has stronger adhesive residue removal capability and realizes the dual-process automation integration structure.
Contrel Technology is also deeply engaged in the Micro-LED (Micro Light Emitting Diode) display field, and has proposed the laser-induced transfer bonding technology, which can be applied to the two mainstream backplanes COB and COG. This Micro LED mass transfer equipment can complete the mass release and fusion bonding at the same time, and together with the intelligent selective mass patching system, it can increase the final yield rate of the product up to 99.999%.
Contrel Technology fully demonstrates its advantages in core technologies such as laser, optical inspection, and automated mechanical and electrical integration at the exhibition, and jointly exhibits with Tongtai Machine & Tool. Visitors are welcome to witness the latest technologies and innovations in the fields of semiconductor packaging and Micro-LEDs. Booth No.: N-1321.
Reported by Xu Yuqing, Economic Daily News
Tech Blog
2022-01-24
【Mini LED Repair Equipment- 1】Preface
The highly anticipated Mini LED Apple iPad Pro was officially announced in April 2021, which means Mini LED entered the first year of commercial use. Since the tremendous growth in the consumer electronics industry all across the world is driving the growth of the mini LED display market, this demand has led to the heavy commercialization of mini LED technology. The global mini LED display market held a market value of USD 174.5 million in 2020 and is estimated to reach USD 9,343 million by the year 2027. The market is anticipated to register a CAGR of 78.3% during the forecast period. However, Mini LED still faces unsatisfactory yield rates.
If the COB yield rate and the equipment quality can be enhanced, the current problem of Mini LED production could be solved. Contrel Mini LED Repair Equipment is launched as the market required.
▲ 2018- Mini LED started to develop
▲ 2021- Apple and Samsung announced various Mini LED products
▲ 2027- The market value of Mini LED is expected to reach USD 93 million
If the COB yield rate and the equipment quality can be enhanced, the current problem of Mini LED production could be solved. Contrel Mini LED Repair Equipment is launched as the market required.
▲ 2018- Mini LED started to develop
▲ 2021- Apple and Samsung announced various Mini LED products
▲ 2027- The market value of Mini LED is expected to reach USD 93 million
News
Contrel Technology provides a full range of solutions, including RDL laser circuit repair, glass carrier dicing, glass substrate drilling for packaging, glass carrier edge EMC trimming, laser stripping equipment, and plasma etching, all of which are available.
The RDL (Redistributed Line) laser circuit repair equipment is equipped with the function of repairing metal line defects, and can control the repair line width to 1μm, so as to meet the repair of products with 2μm circuit width spacing. It is also equipped with automatic optical measurement, with low to high magnification lens flexibility, to realize fast automated and accurate measurement, and can automatically plan the repair path, effectively saving cost and efficiency.
The glass cutting machine is equipped with a dual-laser dual-axis structure for texturizing and thermal cracking, which allows for fast and automated cutting of transparent, hard and brittle materials with composite structures and shaped shapes, and the chipping angle of the cutter is controlled to be within 10 μm, in order to meet the demands of high-yield and high-quality manufacturing processes. In terms of glass substrate drilling equipment, Contrel Technology utilizes laser texturizing and wet processing to complete TGV technology with a depth-to-width ratio of more than 5 to 1. The glass carrier edge-mounted epoxy resin (EMC) trimming equipment employs simultaneous laser double-sided operation to precisely remove the overflow of adhesive on the edges, so that glass carriers can be reused after the disassembly process, which is in line with the concept of green and environmentally friendly production. The laser stripping and plasma etching equipment utilizes the integrated design of plasma microwave and radiofrequency, which has stronger adhesive residue removal capability and realizes the dual-process automation integration structure.
Contrel Technology is also deeply engaged in the Micro-LED (Micro Light Emitting Diode) display field, and has proposed the laser-induced transfer bonding technology, which can be applied to the two mainstream backplanes COB and COG. This Micro LED mass transfer equipment can complete the mass release and fusion bonding at the same time, and together with the intelligent selective mass patching system, it can increase the final yield rate of the product up to 99.999%.
Contrel Technology fully demonstrates its advantages in core technologies such as laser, optical inspection, and automated mechanical and electrical integration at the exhibition, and jointly exhibits with Tongtai Machine & Tool. Visitors are welcome to witness the latest technologies and innovations in the fields of semiconductor packaging and Micro-LEDs. Booth No.: N-1321.
Reported by Xu Yuqing, Economic Daily News
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Fan-out Packaging Glass Carrier Boards - Contrel Creates a Complete Solution for Cutting and Repairing
Contrel Technology (8064) participated in this year's TPCA exhibition with the theme of "Fan-out Packaged Glass Carrier Dicing and Repairing Solution", responding to the demand for equipment for high-end chip applications such as 5G communication, AI artificial intelligence, and Internet of Things (IoT), and demonstrating the development results of the carrier edge trimming, rewire repair, and TGV drilling in the various stages of the production process equipment.
Contrel Technology provides a full range of solutions, including RDL laser circuit repair, glass carrier dicing, glass substrate drilling for packaging, glass carrier edge EMC trimming, laser stripping equipment, and plasma etching, all of which are available.
The RDL (Redistributed Line) laser circuit repair equipment is equipped with the function of repairing metal line defects, and can control the repair line width to 1μm, so as to meet the repair of products with 2μm circuit width spacing. It is also equipped with automatic optical measurement, with low to high magnification lens flexibility, to realize fast automated and accurate measurement, and can automatically plan the repair path, effectively saving cost and efficiency.
The glass cutting machine is equipped with a dual-laser dual-axis structure for texturizing and thermal cracking, which allows for fast and automated cutting of transparent, hard and brittle materials with composite structures and shaped shapes, and the chipping angle of the cutter is controlled to be within 10 μm, in order to meet the demands of high-yield and high-quality manufacturing processes. In terms of glass substrate drilling equipment, Contrel Technology utilizes laser texturizing and wet processing to complete TGV technology with a depth-to-width ratio of more than 5 to 1. The glass carrier edge-mounted epoxy resin (EMC) trimming equipment employs simultaneous laser double-sided operation to precisely remove the overflow of adhesive on the edges, so that glass carriers can be reused after the disassembly process, which is in line with the concept of green and environmentally friendly production. The laser stripping and plasma etching equipment utilizes the integrated design of plasma microwave and radiofrequency, which has stronger adhesive residue removal capability and realizes the dual-process automation integration structure.
Contrel Technology is also deeply engaged in the Micro-LED (Micro Light Emitting Diode) display field, and has proposed the laser-induced transfer bonding technology, which can be applied to the two mainstream backplanes COB and COG. This Micro LED mass transfer equipment can complete the mass release and fusion bonding at the same time, and together with the intelligent selective mass patching system, it can increase the final yield rate of the product up to 99.999%.
Contrel Technology fully demonstrates its advantages in core technologies such as laser, optical inspection, and automated mechanical and electrical integration at the exhibition, and jointly exhibits with Tongtai Machine & Tool. Visitors are welcome to witness the latest technologies and innovations in the fields of semiconductor packaging and Micro-LEDs. Booth No.: N-1321.
Reported by Xu Yuqing, Economic Daily News
Contrel Technology provides a full range of solutions, including RDL laser circuit repair, glass carrier dicing, glass substrate drilling for packaging, glass carrier edge EMC trimming, laser stripping equipment, and plasma etching, all of which are available.
The RDL (Redistributed Line) laser circuit repair equipment is equipped with the function of repairing metal line defects, and can control the repair line width to 1μm, so as to meet the repair of products with 2μm circuit width spacing. It is also equipped with automatic optical measurement, with low to high magnification lens flexibility, to realize fast automated and accurate measurement, and can automatically plan the repair path, effectively saving cost and efficiency.
The glass cutting machine is equipped with a dual-laser dual-axis structure for texturizing and thermal cracking, which allows for fast and automated cutting of transparent, hard and brittle materials with composite structures and shaped shapes, and the chipping angle of the cutter is controlled to be within 10 μm, in order to meet the demands of high-yield and high-quality manufacturing processes. In terms of glass substrate drilling equipment, Contrel Technology utilizes laser texturizing and wet processing to complete TGV technology with a depth-to-width ratio of more than 5 to 1. The glass carrier edge-mounted epoxy resin (EMC) trimming equipment employs simultaneous laser double-sided operation to precisely remove the overflow of adhesive on the edges, so that glass carriers can be reused after the disassembly process, which is in line with the concept of green and environmentally friendly production. The laser stripping and plasma etching equipment utilizes the integrated design of plasma microwave and radiofrequency, which has stronger adhesive residue removal capability and realizes the dual-process automation integration structure.
Contrel Technology is also deeply engaged in the Micro-LED (Micro Light Emitting Diode) display field, and has proposed the laser-induced transfer bonding technology, which can be applied to the two mainstream backplanes COB and COG. This Micro LED mass transfer equipment can complete the mass release and fusion bonding at the same time, and together with the intelligent selective mass patching system, it can increase the final yield rate of the product up to 99.999%.
Contrel Technology fully demonstrates its advantages in core technologies such as laser, optical inspection, and automated mechanical and electrical integration at the exhibition, and jointly exhibits with Tongtai Machine & Tool. Visitors are welcome to witness the latest technologies and innovations in the fields of semiconductor packaging and Micro-LEDs. Booth No.: N-1321.
Reported by Xu Yuqing, Economic Daily News
Tech Blog
2022-01-24
【Mini LED Repair Equipment- 1】Preface
The highly anticipated Mini LED Apple iPad Pro was officially announced in April 2021, which means Mini LED entered the first year of commercial use. Since the tremendous growth in the consumer electronics industry all across the world is driving the growth of the mini LED display market, this demand has led to the heavy commercialization of mini LED technology. The global mini LED display market held a market value of USD 174.5 million in 2020 and is estimated to reach USD 9,343 million by the year 2027. The market is anticipated to register a CAGR of 78.3% during the forecast period. However, Mini LED still faces unsatisfactory yield rates.
If the COB yield rate and the equipment quality can be enhanced, the current problem of Mini LED production could be solved. Contrel Mini LED Repair Equipment is launched as the market required.
▲ 2018- Mini LED started to develop
▲ 2021- Apple and Samsung announced various Mini LED products
▲ 2027- The market value of Mini LED is expected to reach USD 93 million
If the COB yield rate and the equipment quality can be enhanced, the current problem of Mini LED production could be solved. Contrel Mini LED Repair Equipment is launched as the market required.
▲ 2018- Mini LED started to develop
▲ 2021- Apple and Samsung announced various Mini LED products
▲ 2027- The market value of Mini LED is expected to reach USD 93 million